| 摘要 |
PURPOSE:The title molding material is obtained by adding a modified silicon compound to an epoxy resin at a specific ratio, thus being suitable for use in sealing semiconductors, because it has good moldability, high resistance to moisture and low stress. CONSTITUTION:The objective molding material is obtained by adding (A) 2-30pts.wt. of a modified silicon compound such as aminosilicone intermediate with an amino equivalent of 500-3,000 and (B) a curing agent and/or curing promotor to (C) 100pts.wt. of an epoxy resin such as a novolak type epoxy resin. The component A is used after it is dispersed in the component B or C.
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