| 摘要 |
PURPOSE:To increase processing capability and to improve productivity, by not lowering a probe to the defective circuit chip part and the monitoring circuit chip part of a wafer but skipping them, and testing only perfect chip parts. CONSTITUTION:The defective examination information of a photomask is inputted and processed in a mini-computer 23 and recorded in a recording means. By the command based on the information of the photomask from the computer 23 with respect to a wafer 7 to be tested a wafer tester 26 and an X-Y table 27 are controlled. A probe 28 of a device 26 is not lowered to a defective circuit chip part and a monitoring circuit chip part of the wafer 7 but skips them. The X-Y table 27 likewise skips them. The probe 28 is lowered and contracted to only perfect chip parts, and the test is performed. Thus the processing capability is increased and the productivity is improved. |
