| 摘要 |
PURPOSE:To carry out high-speed silver electroplating giving high adhesion on a metallic substrate contg. iron or Ni without requiring striking by continuously supplying electric current at a very high current density in the early stage and at a prescribed high current density in the following stage. CONSTITUTION:When high-speed silver electroplating is carried out on a substrate of an iron or Ni alloy, metallic iron or metallic Ni, electric current is continuously supplied at a very high current density in the early stage and at a prescribed high current density in the following stage. The preferred very high current density in the early stage is about 300-1,500A/dm<2>, the supply time is about 0.005-0.1sec, and the current rising time is <=about 0.02sec. A high-speed silver plating bath used has about 50-80g/l concn. of silver and is kept at about 40-80 deg.C.
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