| 摘要 |
PURPOSE:To keep the electric connectivity of an Ag coated Cu material stable for a long period by sticking a soln. contg. a specified amount each of a mercapto compound, benzotriazole and a trifluorochloroethylene polymer on the surface of the Cu material. CONSTITUTION:0.01-5% Mercapto compound (M), e.g., laurylmercaptan and 0.01-10% benzotriazole or deriv. thereof (BTA), e.g., benzotriazole are dissolved in a solvent such as trichloroethylene in 0.02-50 concn. ratio of M/BTA, and 0.1-10% in total of a trifluorochloroethylene polymer and/or perfluoroalkyl polyether is further dissolved. The resulting soln. is stuck to the surface of a Cu or Cu alloy material coated with Ag or an Ag alloy by dipping, spraying or other method to a prescribed thickness.
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