发明名称 EPOXY RESIN MOLDING MATERIAL FOR SEMICONDUCTOR SEALING
摘要 PURPOSE:The title epoxy resin molding material that contains a small amount of a cyclic pyridine bearing a triazine skeleton, thus giving molded products of high resistance to moisture and good electrical properties at elevated temperatures. CONSTITUTION:The objective molding material is obtained by combining (A) 100pts.wt. of an epoxy resin such as of bisphenol A or novolack type with 0.01-1pt.wt. of a cyclic pyridine bearing a triazine skeleton such as 2,4,6-tri-4- pyridyl-S-triazine or 2,4-di-4-pyridyl-6-methyl-S-triazine, further in addition, an amine curing agent, crosslinking agent, fillers, releasing agent and surface active agent.
申请公布号 JPS61133227(A) 申请公布日期 1986.06.20
申请号 JP19840255474 申请日期 1984.12.03
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 KAGAWA HIROHIKO
分类号 C08G59/00;C08G59/40;C08G59/50;H01L23/29;H01L23/31 主分类号 C08G59/00
代理机构 代理人
主权项
地址