| 摘要 |
PURPOSE:To provide the titled composition of high heat resistance, capable of easily and completely removing the coating film therefrom from substrate by only a small impact force, comprising polyimide resin and specific alkyl silicate in a specific proportion. CONSTITUTION:The objective composition can be obtained by incorporating (A) 100pts.wt. of a polyimide resin (e.g., polyamide-imide resin) with (B) 5-100 pts.wt. of an alkyl silicate having <=8C alkyl group (e.g., ethyl silicate) and other ingredient(s).
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