| 摘要 |
PURPOSE:To prevent the separation at a bonding interface and warping of an electrode due to difference in thermal expansion coefficients between insulating resin and a collar part, by providing a recess groove between the periphery of a semiconductor rectifier element and the collar part, and making the thickness of the collar part thinner than the thickness of the electrode at the recess groove. CONSTITUTION:In a recessed container 4, which has a first electrode 2 and a collar part 3 that is formed continuously from the electrode, a solder 5, a semiconductor rectifier element 1, a solder 6 and a lead wire 7 that is to become another electrode are sequentially laminated. They are electrically connected by the solders 5 and 6. A recess groove 11 is formed in the electrode at the boundary between the electrode 2 and the collar part 3. The thickness of the collar part 3 is made thinner than the depth of the recess part 11. Then the element 1 and the lead wire 7 are coated, and the inside of the recess groove 11 in the electrode 2 is coated by a fixing part of an insulating protecting material 8, which protects a P-N junction part of the element 1. Then, the entire surface is coated by an insulating resin 9 so as to protect the device from external air and to give mechanical protection against external force. |
