| 摘要 |
PURPOSE:To contrive improvement in the yield of production and reliability of the title equipment by a method wherein each pot is directly interconnected to a cavity through the intermediary of a hollow region, and said hollow region is formed in a bent structure. CONSTITUTION:A semiconductor element 4 is placed in a cavity 3 as shown by the broken line in the diagram, a tablet 6 is placed in a pot 1, and a plunger 11 is operated. At this time, as a molding machine is heated up to 170 deg.C or thereabout, the tablet 6 is fused and pushed out to a hollow region 5. However, as the hollow region 5 is heated up to 170 deg.C or thereabout and also the region 5 is bent as shown in the diagram, the sealing resin passes through a gate 51 and injected into the cavity 3 after it is fully fused and mixed in the hollow region 5. As the resin is fully fused and mixed, a molding can be performed uniformly and completely on the region around the chip of the semiconductor device. |
