| 摘要 |
PURPOSE:To enable to obtain an extremely high matching precision by a method wherein a global alignment mode is provided using the second optical system with a magnification higher than that of the first optical system for off-axis alignment. CONSTITUTION:When an off-axis alignment and a TTT alignment are performed, a TV2 for high magnifacation is used as the display monitor, and when the off-axis alignment is performed, the reference mark TRR(L) of the index-glass plate R(R)18 of the off-axis optical system OA and the marks CRL (LR)11 and 12 for high-magnification alignment of a wafer WF are displayed on the display image surface of the TV2 and the matching state of both marks can be confirmed. Moreover, a mask WPR(L)1 for low magnification and the reference (cursor) line KSL, which is electronically set, are compared using a TV1 for low magnification and the alignment is performed. Marks WSR and WSL, which are projected by a reticle RT, are displayed on the display image surface of the TV1 for low magnification as marks WKR and WKL, which are projected by the wafer WF, using the TTL alignment optical system AS and the matching state that both masks are aligned by a TTL can be confirmed. |
