发明名称 SEMICONDUCTOR DEVICE
摘要 <p>PURPOSE:To reduce the height of glass sealing type diode for securing airtightness by a method wherein a diode pellet is connected between end of lead while main parts thereof are inserted into glass sleeve or cap to be heated for airtight sealing process. CONSTITUTION:A glass tablet 10 is inserted into leads 5a, 5b and then a diode pellet 4 is fixed on one end of lead 5a to connect the electrode 4 to the other lead 5b by a metallic wire 6 Besides, a glass sleeve 13 is contained in a lower jig 11 with perforation to insert the leads 5a, 5b into a recession to contain the glass sleeve 13 for dropping the glass tablet 10 into the glass sleeve 13. Then the leads 5a, 5b are lowered to locate the pellet 4 in the glass sleeve 13. Next the lower jig 11 is covered with an upper jig 15 with a forming jig 14 serving both as a weight inserted thereinto to be fed to a heating furnace for welding one end of glass sleeve 13 into the glass tablet 10. Finally the other end is bent-formed into a glass enclosure 7 by the forming jig 14 to be airtightly sealed.</p>
申请公布号 JPS61131550(A) 申请公布日期 1986.06.19
申请号 JP19840254400 申请日期 1984.11.30
申请人 NEC KANSAI LTD 发明人 MATSUHABA HIROTO
分类号 H01L23/02;H01L21/50;H01L23/48 主分类号 H01L23/02
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