| 摘要 |
PURPOSE:To surely prevent a flow meter from being blocked so as to well supply an abrasive, by allowing pure water to also flow in the flow meter for use of the abrasive when the pure water is supplied after polishing is finished, in the case of a polishing machine for a semiconductor wafer or the like. CONSTITUTION:When polishing is performed, an abrasive is supplied to a polishing machine through a flow meter FM-1 by opening a solenoid valve SV-1. After this polishing is finished, a cleaning device, closing the solenoid valve SV-1 while opening a solenoid valve SV-2 and supplying pure water to the polishing machine 1 through a flow FM-2, washes away the abrasive adhering to a work. While the device, opening a solenoid valve SV-3 and allowing a part of the pure water to flow into the polishing machine 1 via the flow meter FM-1, cleans the abrasive adhering to the flow meter FM-1. And here a flow of the pure water is regulated by the flow meter FM-1. In this way, the flow meter FM-1 can be easily prevented from being blocked due to the abrasive. |
