发明名称 |
PB HIGH MELTING POINT SOLDER AND ITS PRODUCTION |
摘要 |
PURPOSE:To obtain an inexpensive Pb high melting point solder that the solidus temp. and liquidus temp. are high and approaching each other, having excellent soldering by adding the specified quantity of Cu and Ge to Pb-Sn alloy. CONSTITUTION:The molten alloy 4 containing 0.5-5wt% Sn, 0.05-5wt% Cu and 0.05-2wt% Ge and consisting of the balance Pb is spouted on the surface of the cooling roll 1 moving at high speed and solidified in a tape shape directly from a molten metal. It has thus high solidus temp. and liquidus temp. and an excellent soldering to improve the operability in semiconductor bonding and to elevate the productivity and yet reliability. |
申请公布号 |
JPS61132295(A) |
申请公布日期 |
1986.06.19 |
申请号 |
JP19840253743 |
申请日期 |
1984.11.30 |
申请人 |
FURUKAWA ELECTRIC CO LTD:THE |
发明人 |
INABA TOSHIAKI;SHIROYAMA KAISUKE;KIKUCHI SUKEYUKI;KOSUGI KEIZO |
分类号 |
C22C11/00;B23K35/26 |
主分类号 |
C22C11/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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