| 摘要 |
PURPOSE:To enhance connecting strength and electric conductivity by performing the formation of exciting coils of layers and the connection between the layers at laminating time by plating by conductor filling method. CONSTITUTION:A photoconductive film 30 is bonded onto an insulating substrate 26 treated in advance with catalyst 28, and a recess pattern for forming an exciting coil 24a is formed on the film by a photograph system and etching. Thus, the surface of the substrate 26 is exposed. A copper material is plated by an electroless plating method to the same thickness as the adjacent nonplated surface of the film. After a catalyst is again treated on the surface of the first layer 22 formed with the coil 24a. The film 30 for the second layer is bonded, and a recess pattern for forming the other exciting coil 24b is formed. Similarly, the exciting coil is sequentially formed.
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