DISPOSITIVO PER LO SMONTAGGIO NON DISTRUTTIVO D'UN COMPONENTE ELETTRONICO MODULARE SALDATO MEDIANTE UNA PLURALITA' DI TERMINALI DI RACCORDO SU UN SUBSTRATO

摘要

A device for semi-automatic dismantling of a modular component which is soldered and attached to a substrate forming a printed circuit. The component to be dismantled is placed under a hot gas source while a force member applies a resilient thrust, the force member comprising a needle arranged to be placed at the base of the component. The needle is slightly bent to apply a biasing force before controlling the ejection of the hot gas to cause melting of the solder at the ends of the connecting pieces and melting of the adhesive layer by which the component is attached to the substrate.