发明名称 AUTOMATIC BONDING DEVICE
摘要 <p>PURPOSE:To eliminate automatically, surely and efficiently parts having failure in bonding, by detecting a time during the application of an adhesive through the bond thereof and conducting bonding if the detected time is within a predetermined time. CONSTITUTION:A part 7a is carried in a work holder 55 by means of the chuck 41 of a carrying device 4, a cylinder 54 is operated to raise the holder 55, an adhesive is allowed to drop onto the part 7a, the holder 55 is descended, the part 7a is carried in a work holder 6a by means of the chuck 41 and at the same time, a part 7b placed in a case 8 is attracted by a chuck 3 and positioned on the surface of the part 7a to be bonded with the adhesive to temporarily bond them to each other, and they are transferred to a work holder 6b. A time required during an adhesive coating mechanism 5 through a pressing mechanism 9 is detected. When the detected time is within a predetermined range, the parts 7a, 7b are conveyed to the work bench 94 of the pressing mechanism 9 by actuating a driving device 13 and a pressing board 93 is descended by driving a cylinder 91 to finally bond the parts 7a, 7b to each other.</p>
申请公布号 JPS61130386(A) 申请公布日期 1986.06.18
申请号 JP19840253016 申请日期 1984.11.30
申请人 TOSHIBA CORP 发明人 INOUE KOICHI
分类号 C09J5/00;B29C65/00;B29C65/48;B29C65/52;B29C65/78 主分类号 C09J5/00
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