| 摘要 |
PURPOSE:To obtain a eutectic compound solder which can execute soldering of a substrate for an electronic apparatus whose heat resisting property is not good, by mixing a proper quantity of a powder of a low temperature solder containing Bi, into a eutectic compound solder powder, and dropping a melting point of the eutectic compound solder. CONSTITUTION:A powder of a low temperature solder containing Bi is mixed uniformly by 3-20wt% into a powder of a eutectic compound solder whose basic composition is 63 Sn-Pb, etc. and to which Ag, Sb and Cu of a small quantity have been added, and the mixed powder and a liquid flux are mixed and formed like cream. When the powder of the low temperature containing Bi is smaller than 3wt%, there is no effect for quickening the melting of the eutectic compound solder powder, and when said powder is mixed by >=20wt%, the soldered part becomes fragile after solding. By using a cream solder obtained in this way, chip-shaped electronic parts can be soldered to a substrate material for an electronic apparatus whose heat resisting property is bad, such as a polyamide substrate, etc. |
