发明名称 |
Plastic package with lead frame crossunder |
摘要 |
Proposed is a new way to distribute power off chip using a specially designed lead frame. The support paddle of the lead frame is split electrically and provides at least two conductor members that are arranged to cross under the chip after the chip is bonded to the paddle. Power and/or ground can be distributed to two or more edges of the chip by providing bonding sites at or near the extremities of the crossunders. The chip itself is electrically isolated from the crossunder members.
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申请公布号 |
US4595945(A) |
申请公布日期 |
1986.06.17 |
申请号 |
US19830544420 |
申请日期 |
1983.10.21 |
申请人 |
AT&T BELL LABORATORIES |
发明人 |
GRAVER, RONALD N. |
分类号 |
H01L23/12;H01L23/48;H01L23/495;H01L23/50;(IPC1-7):H01L23/48;H01L23/10 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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