| 摘要 |
PURPOSE:To facilitate the centering and alignment of wafers with different diameter dimensions by a method wherein a semiconductor wafer is moved by suction to a supporting base, and this wafer is brought into abutment against a cylinder conical in inner surface which is arranged in opposition to the supporting base. CONSTITUTION:The conical base cup 6 (cylindrical) of the titled equipment is supported with a supporting member 7, and the horizontal cross-section of the cup 6 is formed 2-dividably in right-left symmetry in the axial direction by having a part 61 corresponding to the facet of the semiconductor wafer 1 with a shape similar to that of the wafer 1. The wafer 1 is sucked to the wafer supporting base of this producer and moved immediately downward the conical cup 6, and the suction is released at this position. Thereafter, while the supporting base 2 is aligned by gradual ascent, this base 2 is set stationary at the part of coincidence between the wafer 1 and the conical cup 6 in cross-sectional shape, thus completing alignment. The wafer 1 is sucked to the supporting base 2, the the conical cup 6 is divided into two, resulting in the easy centering and alignment of wafers 1 with different diameter dimensions. |
