| 摘要 |
PURPOSE:To prevent the generation of stress due to the bending of a lead frame after soldering, by restricting the soldering length for the lead frame by means of the insulating solder resist formed on the one end of the frame to be soldered. CONSTITUTION:When a lead frame 9 is soldered on the substrate terminal 6 of a substrate 2, the soldering can be performed without dispertion of the soldering interface 10 between lead frames 9, 9 since the solder resist 11 is already formed on the soldering interface 10 on the soldering terminal 9a of the lead frame 9 to restrict the length for the soldering. Therefore, the lead frame 9 is not applied stress even if the lead frame 9 is folded to contact it is the inside terminal 4 of a package 3 during the welding process at the next stage. |
