发明名称 ASSEMBLY OF SOLID-STATE IMAGE PICKUP ELEMENT
摘要 PURPOSE:To eliminate the possibility of the generation of scorching by forming an interference film for compensating sensitivity onto the surface of a birefringent plate and bonding the birefringent plate with the front surface of a solid-state image pickup element. CONSTITUTION:An interference film 12 for compensating sensitivity is shaped previously onto the surface of a birefringent plate 11, and the birefringent plate 11 is fixed onto the front surface of a solid-state image pickup element 10 through proper dhesives. Since the birefringent plate, the surface thereof is coated with the interference film for compensating sensitivity, is bonded directly with the solid-state image pickup element, a filter for compensating sensitivity which have been used positively can be omitted, thus compacting the constitution of the element, then also reducing weight. Since a birefringent plate made of quartz has strong melting resistance to the outside air, no scorching is generated even when the birefringent plate and the solid-state image pickup element are not bonded sufficiently.
申请公布号 JPS61128559(A) 申请公布日期 1986.06.16
申请号 JP19840249674 申请日期 1984.11.28
申请人 HOYA CORP 发明人 AOKI YASUTAKE
分类号 H01L27/14;H01L31/0216;H04N5/335;H04N5/372 主分类号 H01L27/14
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