| 摘要 |
<p>PURPOSE:To improve the integration of a module in taking advantage of a silicon wiring substrate, by mounting the first wiring substrate on the second ceramic substrate, with the mounting surface of an LSI chip positioned lower side, and by cooling the solder from the back side of the first wiring substrate. CONSTITUTION:An electrode for obtaining a signal and an electrode 4 for supplying the power are placed on the center of the silicon wiring substrate 2 on which an LSI chip 1 is mounted, and the silicon wiring substrate 2 is placed on the dashed line part of a ceramic substrate 5. An electrode 6 is provided on the ceramic substrate 5 to electrically connect it to the silicon wiring substrate 1. At first, the LSI chip 1 is connected on the silicon wiring substrate 2 with a solder bump 3, and then, the silicon wiring subtrate 2 is connected on the ceramic substrate 5 with a solder bump 8. Therefore, when the latter is connected, the already connected solder bump 3 will be molten.</p> |
