发明名称 METHOD AND DEVICE FOR FORMING THIN FILM
摘要 PURPOSE:To form a uniform thin film having an excellent quality on a substrate at a high speed, by generating plasma with high-frequency electric power between a substrate electrode and a target electrode after applying a magnetic field to the space between both the electrodes by introducing microwaves to the space. CONSTITUTION:Microwaves are introduced to the space between the target electrode 10, on which a target material 1 is placed, and the substrate electrode 11 holding a wafer 2 in a vacuum chamber 13 which is maintained at the prescribed degree of vacuum by introducing inert gas from a microwave power source 3 through the introducing path 4 a waveguide 12 and the introducing window 9 and, at the same time, after applying a magnetic field which excites electronic cyclotron resonance to electrons, high-frequency electric power is supplied across both the electrodes 10 and 11 from an RF power source 6 for sputtering through a matching circuit 5 and plasma is generated. Therefore, the target material 1 is sputtered by producing the uniform plasma having a high-ion density in the above-mentioned space 8 and a thin film which is uniform and contains no impurities is formed on a wafer 2 at a high speed.
申请公布号 JPS61127862(A) 申请公布日期 1986.06.16
申请号 JP19840249541 申请日期 1984.11.28
申请人 HITACHI LTD 发明人 SAKATA MASAO;KOBAYASHI HIDE;ABE KATSUO;KAMEI TSUNEAKI;SAITO YUTAKA;TATEISHI HIDEKI;AIUCHI SUSUMU
分类号 C23C14/36;C23C14/35;H01L21/203;H01L21/31 主分类号 C23C14/36
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