| 摘要 |
PURPOSE:To form a smooth and uniform plating layer on the surface of a hole section in a short time, by positioning a diaphragm body equipped with a small-diameter through-hole to the hole section of a section to be plated and supplying electricity to an annular section including the diaphragm body after filling the annular section with an electrolyte. CONSTITUTION:An electrolyte 24 is supplied to a supporting member 16. An object to be plated 53 is placed on a table 51 and the center of the hole section 54 of the section to be plated of the object 53 is aligned with the center of the supporting member 16. When the supporting member 16 is lowered and a diaphragm body 21 is put in the hole section 54 just below the diaphragm body 21, the level of the electrolyte 24 in the member 16 rises and the electrolyte 24 is fed to an electrolyte tank 23 through a communicating port 30 by the raised quantity. When the supporting member 16 is lowered to a prescribed position. The small-diameter through-hole 22 of the diaphragm body 21 is filled with the electrolyte 24. Plating works are carried out between the supporting member 16 and object to be plated 53 under the presence of the electrolyte 24 and a metallic film is electrolitically deposited on the hole section 54. Thus a plating layer is formed on the hole section.
|
