| 摘要 |
PURPOSE:To apply a resist adhesion improver in extremely small quantities and desired quantity uniformly onto a wafer by changing a chemical liquid into fine particles by using an ultrasonic oscillator, etc., turning fine particles into a laminar flow and applying fine particles onto the wafer when applying the resist adhesion improver. CONSTITUTION:When a vibrating section for an oscillator 1 is supplied with a resist adhesion improver through a nozzle 4 from a chemical liquid tank 5 and a power supply 2 for the oscillator is turned ON, the oscillator 1 changes a chemicalliquid into fine particles and scatters them. On the other hand, a gas fed from a gas feed opening 13 rises along a side wall in a device by a laminar-flow forming section 6, the course of the gas is bent by the inclination of an uppersurface and the gas falls, a laminar flow falling from an upper section shown in the arrow A is shaped, and the chemical liquid turned into fine particles joins with the flow and is changed into a laminar flow. A chuck 8 is lifted up to a dotted line section in the figure by operating a vertical driving section 12 in order to position a wafer 7 at a position where the state of the laminar flow is shaped. Accordingly, fixed quantity and extremely small quantities of the chemi- cal liquid is applied uniformly onto the whole surface of the wafer 7. |
