| 摘要 |
PURPOSE:To easily cut a transparent substrate by sticking a surface of a substrate with a pattern on a full-cut tape and matching the pattern through a microscope, and then performing fill-cut dicing. CONSTITUTION:The substrate surface is stuck on the full-cut tape 3, which is sucked to a chuck table 1 by vacuum suction through a suction hole 2. The pattern on the top surface of the transparent substrate 4 is recognized from the reverse surface of the transparent substrate 4 through the microscope 6 and matched and then a cutting grindstone thin piece 5 is rotated to the full-cut dicing of the transparent substrate 4 from the reverse surface. Then, the cut substrate is separated from the full-cut tape. This substrate is only in a substrate storage case after the separation, so the cutting surface of the substrate is never broken and the precision of the substrate is maintained.
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