发明名称 METHOD AND DEVICE FOR PLATING BAND-LIKE BODY
摘要 PURPOSE:To improve the plating speed and to reduce the plating cost, by making a plating liquid flow to flow vertically downward along a section to be plated from the top of the strip plating section of each body. CONSTITUTION:A plating tank 4 is composed of an upper chamber 16 which pools a plating liquid 10 and a lower chamber 17 for recovering the plating liquid 10. A plating liquid flowing-out port 14 and plural fine slits 13 are provided in the side wall 18 of the upper chamber 16 to make the electric current distribution uniform with respect to a section to be plated. A band-like body 1 is held in front of the side wall 18 of the upper chamber 16 and the plating liquid 10 is made to flow out in the direction shown by the arrow from the top of a stripe plating section 12. A skirt section is fitted to the lower end of the side wall 18 along the flowing route of the plating liquid 10 and the plating liquid 10 is circulated by means of a pump, etc. When such as a method is applied, the plating liquid does not go to the backside surface when one-side plating is performed. This method and device can also be applied to both-side plating.
申请公布号 JPS61127895(A) 申请公布日期 1986.06.16
申请号 JP19840249353 申请日期 1984.11.26
申请人 HITACHI CABLE LTD 发明人 YOSHIDA HIROMICHI;SUZUMURA TAKASHI;KAYANE KOICHI;YAMAGISHI RYOZO;YOSHIOKA OSAMU;OKABE NORIO;SUGIYAMA MITSUHIKO;NAKANO FUMIO
分类号 C25D7/06;C25D5/02;C25D5/08 主分类号 C25D7/06
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