发明名称 METHOD FOR ASSEMBLING MODULE
摘要 <p>PURPOSE:To perform a highly reliable airtight sealing by a method wherein an airtight sealing method and a cooling method are changed at the adjusting stage and the final sealing stage of an electric circuit, and a soldering process is performed in the final sealing stage only. CONSTITUTION:Partition-coated cooling blocks 3, whereon a fin 32 is mold-processed at uniform interval on a plate 31, are arranged on the back side of chips 2 which are CCB-connected to a wiring substrate 1, the blocks 3 are connected to a casing 5 through the intermediary of a bellows 4, and cooling water is run through mouth pieces 51 and 52. An O-ring 11 is fitted into the groove of contact point of the substrate 1 and the casing 5, and the chip 2 and the cooling block 3 are airtightly sealed by a clamping means 6 using Si grease. Water is run thereon, an inspection and a reassembling works are performed, the O-ring is removed lastly, He and the like is sealed in the space 7 located inside the casing, and a soldering work 11' is performed. When the disassembling of a module is necessary at this stage, the module can be assembled by performing a minor resoldering work, because the greater part of circuit adjustment is finished. According to this method, the number of soldering works can be reduced to 1/3-1/10, and the reliability in soldering work of finished products can be improved. The cooling work may be performed by dipping into Freon instead of using the cooling block.</p>
申请公布号 JPS61127151(A) 申请公布日期 1986.06.14
申请号 JP19840248125 申请日期 1984.11.26
申请人 HITACHI LTD 发明人 IMAI KUNINORI;CHIBA KATSUAKI;TANAKA MINORU
分类号 H01L23/44;H01L23/04;H01L23/433;H01L23/473 主分类号 H01L23/44
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