发明名称 THERMOSETTING RESIN COMPOSITION
摘要 PURPOSE:A thermosetting resin composition excellent in storage stability, heating stability, etc., and suitable as a solventless varnish, obtained by mixing a polymaleimide with an alkenylphenol (ether) and a specified electron acceptor. CONSTITUTION:The purpose thermosetting resin composition is obtained by mixing a polymaleimide (e.g., N,N'-ethylenedimaleimide) with an alkenylphenol and/or its ether (e.g., o,o'-diallylbisphenol A or o,o'-diallylbisphenol F) and an electron acceptor selected from among an acid (e.g., hydrochloric or phosphoric acid), an active methylene compound (e.g., cyanoacetic acid or malononitrile) and a pi electron acceptor (e.g., 1,3,5-trinitrobenzene or anthraquinone). This resin composition is used as a solventless varnish in impregnation, casting, lamination, molding, bonding, etc.
申请公布号 JPS61126116(A) 申请公布日期 1986.06.13
申请号 JP19840246051 申请日期 1984.11.22
申请人 HITACHI LTD 发明人 KOYAMA TORU;KATAGIRI JUNICHI;WAJIMA MOTOYO
分类号 C08F212/00;C08F212/02;C08F220/00;C08F220/10;C08F222/40;C08K5/05;C08K5/09;C08K5/10;C08K5/16;C08K5/17;C08L25/00;C08L33/00;C08L33/02 主分类号 C08F212/00
代理机构 代理人
主权项
地址