| 摘要 |
PURPOSE:To improve wire bonding property of leads, by sticking an insulating plate to the tab of a lead frame and one surface of inner leads. CONSTITUTION:A package is formed by molding epoxy resin 1. A pellet 4 is attached to a tab 2 at the approximately central part of the package through a so-called silver paste 3. The pellet 4 is electrically connected to the inner end part of leads 7 through a bonding pad 5 and aluminum wire 6. Each lead 7 is bent downward in the vicinity of the side edge of the package. Polyimide resin, which is an insulating plate 8, is stuck to the back surface part, which is one surface of a part of the tab 2 and the inner leads, by bonding agent, tackifier and the like. |
