MANUFACTURE OF SEALED ELECTRON PART

摘要

PURPOSE:To eliminate disconnection of a bonding wire generated at the time of sealing resin by a method wherein an electron part element is mounted in a concave section, which is formed by bending a circuit substrate having a circuit pattern on a surface of a substrate and sealing resin is injected into the concave section. CONSTITUTION:An electron part element 5 is mounted on a surface of a circuit substrate 2 which forms a circuit pattern 1. The circuit pattern 1 and the electron part element 5 are connected electrically by a bonding wire. A concave section 7 is formed by bending the same. In this manner, the electron part element 5, which is mounted on the circuit substrate with the bent electron part element, is made to perform sealing resin to protect the element from shock and moisture.