| 摘要 |
PURPOSE:To prevent deterioration in the quality of a read picture, by arranging a plurality of photoelectric conversion element array chips, and preventing the falling of the photoelectric conversion elements at a connecting part. CONSTITUTION:On photoelectric conversion element array chips 111 and 112 on a substrate, photoelectric conversion elements 12 are provided at a pitch P. On photoelectric conversion elements 131 and 132 on both end parts of a connecting part 14, a plurality of small photoelectric conversion element groups 171a-171c and 172a-172c, which are connected by wirings 161 and 162 that are separately provided, are formed. Both end surfaces of both photoelectric conversion element array chips 111 and 112, which are contacted with the connecting part 14, are made to form a straight line. Therefore, the small photoelectric conversion element groups 171a-171c and 172a-172c are all good. But only the central small photoelectric conversion element groups 171b and 172b are made alive, and others are disabled by fusing and cutting the wirings 161 and 162 by laser light. One photoelectric conversion element is formed by 171b and 172b at the same pitch of the other photoelectric conversion elements 12. Thus the yield rate at the time of dicing of the chip itself can be improved. |
