发明名称 PLASMA ETCHING APPARATUS
摘要 PURPOSE:To prevent aluminum wirings from disconnecting, by providing an organic-treating means which deposits organic material to a treated wafer which is carried out of a wafer treating chamber through a preliminary vacuum chamber, and does chemical treatment by which chlorine contained in resists is separated from moisture in the atmosphere. CONSTITUTION:An organic-treating chamber 10 is hermetically connected to the wafer carrying-out side of a preliminary vacuum chamber 3, and is made an atmosphere containing vapor of organic liquid 12 by setting the organic liquid 12 therein, sop so that the vapor of the organic liquid 12 can be contacted onto the surface of a wafer 8b carried out by a belt 9 to cover the wafer 8b with an organic film. In this way, chemical treatment is done by which chlorine contained in resists and moisture in the atmosphere can be separated. Accordingly, it can be prevented that aluminum wirings under the resist may be disconnected.
申请公布号 JPS61125020(A) 申请公布日期 1986.06.12
申请号 JP19840246925 申请日期 1984.11.21
申请人 NEC KYUSHU LTD 发明人 OSAKI MINORU
分类号 C23F4/00;H01L21/302;H01L21/3065 主分类号 C23F4/00
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