| 摘要 |
PURPOSE:To conduct coining without twisting inner leads, and to reduce defectives by punching and forming a beltlike material so that sections in the vicinity of the noses of adjacent inner leads are connected mutually, coining the beltlike material and detaching it. CONSTITUTION:The noses of inner leads 11 facing a pad 10 for a lead frame constituting a semiconductor device, such as an IC, an LSI, etc. are punched and shaped by a lead-frame punching die so as to be slightly connected to the noses of adjacent inner leads by connecting sections 12. Coining for ensuring the flat width of the noses of the inner leads is conducted. The connecting sections 12 for the lead frame through a plating process and a taping process are punched, and the noses of the inner leads are detached mutually. |
