发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To connect reliably an internal electrode and a wire, by forming a groove longitudinally in the internal electrode surface wire bonded. CONSTITUTION:A groove 8 is formed longitudinally in each lead 3a, at the tip of the lead 3a neighbouring a tab 4, the lead 3a constituting an internal lead at a wire bonding section of a lead frame. The groove 8 has such a reversed tapering shape that the groove width is narrow near the opening surface and is wider as nearer the bottom. The groove 8 and a bonding pad 7 on a pellet 5 are electrically connected by a wire 9 made of gold. This electrical connection using the wire 9 is done as follows: Ball-bonding is done onto the bonding pad 7 lying on the pellet 5 and then the other end of the wire 9 is pressured against the groove 8 section on the lead 3a by the capillary tip while keeping a sufficient wire loop height, so that a portion of wire material can be pressed into the groove 8 to attain the electrical conduction.
申请公布号 JPS61125028(A) 申请公布日期 1986.06.12
申请号 JP19840245985 申请日期 1984.11.22
申请人 HITACHI LTD 发明人 MASUDA MASACHIKA
分类号 H01L21/60 主分类号 H01L21/60
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