| 摘要 |
PURPOSE:To reduce the thermal resistance and the forward voltage drop, by protruding the fixing part of the explosion-proof ring body on the peripheral surface of the electrodes, and by pressing the semiconductor substrate with uniform and sufficient pressure through the total contact surface of the electrodes which press contact the semiconductor substrate. CONSTITUTION:The anode 22 is pressed against the back surface of the semiconductor substrate 20 through the supporting plate 21. The explosion-proof ring body 23 is fitted around the peripheral surface of the anode 22. The cathode 24 is pressed against the surface of the substrate 20. The cathode 24 and the anode 22 are made of cylindrical copper. The explosion-proof ring body 25 is fixed on the peripheral surface of the cathode 24. The fixing part 26 is formed, which consists of two edge parts jutting out like flange on the periphery of the cathode 24. The explosion-proof rint 25 is inserted into the groove formed between the edge parts and is fixed. The explosion-proof rings 23 and 25 constituted integrally the explosion-proof ring structure 27, which is closely fixed to the container 28. |
