| 摘要 |
PURPOSE:A resin composition for heat-resistant laminates which is obtained by including a reactive phosphoric acid ester in the molecular skeleton of a melamine-modified phenolic resin and using a polyamide resin as a thermoplastic auxiliary agent, thus showing good electrical properties, cold punching properties and low water absorption. CONSTITUTION:The objective resin composition is prepared from (A) 20-60wt% of a reactive phosphoric acid ester of formula I (R<1>, R<2> are H, 1-20C alkyl), (B) 2-20wt% of a polyamide resin of formula II (R is 0-10C alkyl), (C) a melamine such as benzoguanamine or acetoguanamine and (E) formaldehyde such as formalin or paraformaldehyde. It is preferred that C, D and a part of E are allowed to react, then A and the rest of E are added for reaction, then B is added. The resultant composition is diluted by dissolving it in an organic solvent, then a base material such as paper is impregnated with the solution, dried to form prepregs, then the prepregs are laminated.
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