| 摘要 |
PURPOSE:To inhibit an effect on a semiconductor substrate even when noises are applied to a conductive layer, and to prevent the generation of a malfunction by forming an insulating layer between the semiconductor substrate and the conductive layer, to which fixed potential is applied, and capacitive-coupling the substrate and the conductive layer. CONSTITUTION:A conductive layer 9 is formed onto the surface of an insulating layer 8 shaped to another main surface of a semiconductor substrate 2, a capacitance element is constituted by a semiconductor substrate 5 and the insulating layer 8, and a semiconductor chip is operated under the state in which supply potential or the fixed potential of ground potential is applied to the semiconductor substrate 5 through the conductive layer 9 and the capacitance element consisting of the insulating layer 8 and the semiconductor substrate 5 from a conductive layer 4 in a semiconductor package. Accordingly, even when noises are generated on a power supply line or a grounding line and noises are applied to the conductive layer 4 in the semiconductor package, the conductive layer 9 and the capacitance element constituted by the insulating layer 8 and the semiconductor substrate 5 inhibit the noises, thus approximately eliminating the effect of noises in the semiconductor substrate 5, then preventing the malfunction of the semiconductor chip. |
