| 摘要 |
PURPOSE:To enable high waterproofness by wire bonding a bonding region and the bonding pad of a semiconductor element placed on the stage of a lead frame, and then resin-sealing inner leads, the stage, a stage support rod and the element. CONSTITUTION:Resin such as polyurethane, polybitadiene is spray coated on a lead frame 1, and the film of the resin is coated on the surface of the frame 1. A laser beam is emitted to the bonding region of inner leads 10, and a polymer compound coating film is removed from the region. Then, the frame 1 is placed on a heated bonding block 3, the bonding pads of semiconductor elements 2 and the bonding region of the lead 10 are connected by wirings 5 by a bonding tool 4 while selectively heating the bonding region by blowing hot N2 gas. It is sealed with heat resistant and waterproof resin such as epoxy resin. Thus, the bondability between the frame 1 and the resin 6 can be improved to enhance the waterproofness with high reliability. |
