| 摘要 |
PURPOSE:To attain stability against temperature and to improve reliability by bonding a dielectric resonator unit on a base of a low dielectric constant thicker than a microwave integrated circuit (MIC) substrate adjacent to said substrate. CONSTITUTION:A microstrip line 2 is formed near one end of the MIC substrate 1 made of aluminum, the base 6 made of a low dielectric constant and a low thermal expansion coefficient material such as quartz glass, thicker than the MIC substrate 1 is bonded to a case 7 in a form to be contacted closely with the side face of the side end and a dielectric resonator 3 bonded with a supporting base 5 made of quartz glass is placed on the case 7. Through the constitution above, since the dielectric resonator 3 is held with a prescribed interval with an air gap to the microstrip line 2, both the thermal expansion coefficients are not a direct problem and the electromagnetic coupling between the both is adjusted easily. |
