| 摘要 |
PURPOSE:To bring a diode pellet and upper and lower electrodes into contact excellently by pressing, temperature-elevating and sealing the diode pellet held by the upper and lower electrodes and removing a weight on the upper electrode in a cooling process. CONSTITUTION:A diode pellet 3 consisting of a semiconductor substrate 1 and a metallic bump electrode 2 is held by a lower electrode 4 and an upper elec trode 5, and incorporated into jigs 7, 8 filling the role of heaters, load by a weight 9 is applied onto the upper electrode 5, and the temperatures of the jigs 7, 8 are elevated to heat the pellet 3. When steps transfer to a cooling step, the weight 9 is removed, both the lower and upper electrodes 4, 5 are cooled rapidly, and the diode pellet 3 is cooled at speed faster than a glass sleeve 6 for sealing, thus obtaining a DHD in which the diode pellet 3 and both upper and lower electrodes 5, 4 are brought into contact excellently. |
