发明名称 SEALING CAP SOLDERING APPARATUS
摘要 PURPOSE:To reduce the production cost and to improve the reliability by bonding a heat resistant film opened to contact on the upper surface of a collar of a metal cap inside a frame when coating a cap temporarily securing upper frame on the cap, thereby shortening the soldering time. CONSTITUTION:A solder 23 is interposed, a metal cap 22 is superposed at the prescribed position of a ceramic substrate 21, and placed on four leaf spring claws 28. A male screw 32 is engaged through a hole 31 of a cap temporarily securing upper frame 26 with female threaded hole 30 to integrate a cap temporarily securing lower frame 25 and the frame 26. When a heat transfer adapter 30 arrives at the temperature to the prescribed soldering temperature, the cap temporarily securing unit is disposed with the substrate 21 at the downside, the solder 23 is fused to secure the cap 22 to the substrate 21. Thus, since the heat from a heater 18 is rapidly transferred to the solder 23, the time required to solder the cap 22 is shortened by approx. 1/10 as compared with the conventional method, and the reliability can be further improved.
申请公布号 JPS61124156(A) 申请公布日期 1986.06.11
申请号 JP19840245697 申请日期 1984.11.20
申请人 TOSHIBA CORP 发明人 OGAWA AKIRA
分类号 H01L23/02;H01L21/50 主分类号 H01L23/02
代理机构 代理人
主权项
地址