RESIN COMPOSITION

摘要

PURPOSE:To obtain a resin composition having excellent adhesivity and moisture-proof insulation property and useful as a coating film for the pretection of a circuit board, by compounding specific amounts of an epoxysilane coupling agent and 2-ethyl-4-methylimidazole to a base resin consisting of a thermosetting epoxy resin. CONSTITUTION:The objective composition can be produced by compounding (A) 100pts.(wt.) of a base resin consisting of a thermosetting epoxy resin with (B) 0.2-3pts. of an epoxysilane coupling agent (e.g. gamma-glycidoxy propyltrimethoxysilane) and (C) 0.5-3pts. of 2-ethyl-4-methylimidazole.