| 摘要 |
PURPOSE:A low-cost composition that is composed of a specific sericite and a polyamide resin of a specific relative viscosity, thus reducing greatly the abrasion of mold and relating devices and showing high reinforcing effect without any adverse effect on intrinsically excellent properties of reinforced polyamide resin. CONSTITUTION:The objective resin composition is composed of 20-50wt% of sericite of K2O.3Al2O3.6SiO2.2H2O, which is crushed into particles of less than 25mu average particle sizes and of 50-70wt% of a polyamide resin of 2.3-2.6 relative viscosity. The sericite preferably has less than 10mu particle sizes on the average and is treated with a silane coupling agent.
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