| 摘要 |
PURPOSE:To enable to reduce the size by forming an inductance element directly on an insulating substrate by a supersonic bonding unit with an insulating winding. CONSTITUTION:A conductive path 2 is formed on an insulating substrate 1, a bobbin 3 is disposed, and one end of a winding 5 contained in a reel is supersonically bonded onto one conductive path by a supersonic bonding unit. An insulated winding 5 fed by the reel is uniformly wound by fluctuating vertically the substrate 1 on the bobbin 3, and the other end of the winding 5 is supersonically bonded to the other path 2. Thus, an inductance element is formed with the bobbin 3, the winding 5 and the least parts to obtain very inexpensive one with small size. Since the winding 5 can be wound in the uniform thickness on the bobbin 3 by vibrating a table 8 elevationally, the inductance element having small size and large value can be formed. |
