| 摘要 |
PURPOSE:To position a copper laminated plate on a photofilm simply by inserting guide pins into positioning reference holes formed on the copper laminated plate and positioning the photofilm on the determined position of a substrate. CONSTITUTION:The guide pins 1, 2 are implanted on the upper surface of a transparent substrate 3 and engaged with the positioning reference holes 7, 8 formed on the copper laminated plate 11. Then the photofilm 12 having a circuit pattern is put on a transparent plate 5', supported by a transparent plate 5 and fixed by clamps 4. Then, ultraviolet rays are irradiated from an ultraviolet lamp 9 to the upper surface of the transparent plate 5 to transfer the circuit pattern to the surface of a photoresist 10 of the copper laminated plate 11. |
