| 摘要 |
PURPOSE:To obtain the good contact characteristic of a photoresist film surface by laminating a metal or an alloy which improves surface characteristic or the mixture composed thereof on a vacuum-baked photoresist to improve the adhesiveness thereof. CONSTITUTION:Copper 18 made into a coil construction is provided on an alumina layer 16 of a film-like magnetic head 10 and the photoresist 30 is laminated by vacuum baking thereon. The metal, alloy or the mixture composed thereof, for example, a noble metal alloy 40 such as palladium-gold alloy is laminated by sputtering on the photoresist film in order to improve the surface characteristic thereof. The good adhesiveness is provided to the surface of the baked photoresist by laminating the alloy 40 thereon in the above-mentioned manner, by which the satisfactory lamination in the succeeding stage is made possible.
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