发明名称 AUTOMATIC CONTACT BONDING DEVICE
摘要 PURPOSE:To bond thin sheet-like articles by contact automatically by a method wherein accommodating sections for accommodating the articles to be bonded are provided in both of upper and lower molds the suction and blow-out devices are connected to the same accommodating sections while the existence of the articles to be bonded by contact in the accommodating sections is detected by detecting switches. CONSTITUTION:The articles (x), (x) to be bonded are accommodated in respective accommodating chambers 2, 7 of the upper and lower molds 1, 6, and the suction device P1 is operated to hold the articles by suction respectively while peeling paper (y) is peeled to exposed bonding sheets adhered to the surfaces of the articles to be bonded by contact. The existence of the articles to be bonded are confirmed by first and second detecting switches SW1, SW2 and mold clamping is confirmed by the third detecting switch SW3 after closing the molds, thereafter, the blow-out device P2 is operated to laminated and integrate both of the articles.
申请公布号 JPS61121929(A) 申请公布日期 1986.06.09
申请号 JP19840245282 申请日期 1984.11.19
申请人 BROTHER IND LTD 发明人 KAKO MITSUMASA
分类号 B29C65/48;B29L9/00 主分类号 B29C65/48
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