| 摘要 |
PURPOSE:To enable to prevent the coming off of a metal protrusion from a substrate by a method wherein the metal protrusion is formed on a long-sized tape substrate, conveyed to a film lead, and transfer and coupling processes are performed successively. CONSTITUTION:A metal protrusion of the prescribed shape is formed in a plating vessel 4 while a tape substrate 1 is being continuously moved and conveyed 8 successively, it is cleaned and moved to a bonding structure part 3. A flexible film tape 9 is conveyed to the bonding structure part 3 along a tape guide 10. Moreover, a monitoring camera 11 to be used for positioning of the metal protrusion and a film lead are provided on the substrate 1, and the flexible film tape 9 is finely adjusted for positioning by the -tape guide 10, or the tape substrate 1 is finely adjusted by a stage 12. When the positioning is finished, a bonding tool 13 comes down, pressurizing and heating processes are performed, and the metal protrusion on the tape substrate is transferred and connected to the film lead. |
