| 摘要 |
PURPOSE:To simplify the wafer handling operation between electrical testing and die bonding processes, by providing a device which can read out chip position information and quality characteristics information stored in a memory medium while recognizing the correspondence of the information with the wafer on which the information is concerned. CONSTITUTION:Information on electric tests of each wafer is stored together with identification information as information 10a, 11a... in a memory medium 1 such as a floppy disk or the like. A wafer is taken out from a magazine 2 and identification information 9 marked on the wafer 7 or identification information 8 marked on a jig 6 is read out by an identification information reading out section 4. According to the identification information thus read, the information having the same identification information is selected from the memory medium 1 by a data selecting section 5 and read out. A die bonding section 3 is caused to operate according to this information. This construction can thus eliminate any possibility of becoming impossible to check the wafer even if the order of wafers is changed. |
