| 摘要 |
PURPOSE:To enable easy positioning of a chip of solid-state image pickup element by a method wherein an outer positioning recess or projection for positoning the appearance of a chip of solid-state image pickup element is formed in the upper surface of the stem integrally with the stem. CONSTITUTION:A recess nearly equal to a chip 2 of solid-state image pickup element in appearance is press-formed in the upper surface of a stem 1, and this cap 2 is fixed by positioning in the recess. The lower surface of the stem 1 is reversely formed in projection by press of the recess. The level of this projection is higher than the creep level of the glass that seals lead terminals 3. Otherwise, a plurality of projections 8 are press-formed along the appearance of the chip 2 in the upper surface of the stem 1, and the chip 2 is fixed by positioning with the projections 8. This facilitates the set-up of said chip on the stem. |
